525nm Green Laser-B30W
Izingxenye ze-laser ye-semiconductor zingamandla aphezulu, zisebenza kahle kakhulu, kanye nemikhiqizo ezinzile eyenziwe ngobuchwepheshe bokuhlanganisa obuchwepheshile.Umkhiqizo ugxilisa ukukhanya okukhishwa yi-chip ku-fiber optical enobubanzi obuncane bomgogodla ngokusebenzisa izingxenye ze-micro-optical ukuze okukhiphayo.Kule nqubo, yonke inqubo ebalulekile iyahlolwa futhi iguge ukuze kuqinisekiswe ukwethembeka, ukuzinza nempilo ende yomkhiqizo.
Ekukhiqizeni, abacwaningi baqhubeka bethuthukisa inqubo yomkhiqizo ngobuchwepheshe bomsebenzi nolwazi oluqoqiwe lwesikhathi eside ukuze kuqinisekiswe ukusebenza okuphezulu komkhiqizo.Inkampani iphinde iqhubeke nokuthuthukisa imikhiqizo emisha ukuze ihlangabezane nezidingo ezikhula njalo zamakhasimende.Izintshisekelo zamakhasimende bezilokhu zibekwe kuqala, futhi ukuhlinzeka amakhasimende ngemikhiqizo yekhwalithi ephezulu, engabizi kuwumgomo ongaguquki wenkampani.
Qaphela
【1】 Kukhona isamba samashubhu e-laser semiconductor angu-32 ngaphakathi kwelaser, futhi angu-8 ngalinye lixhunywe ochungechungeni ukwenza umgwaqo, isamba sezintambo ezine.
【2】Sicela ugcine endaweni engajiki
【3】 Izinga lokushisa elisebenzayo le-laser lisho izinga lokushisa le-base plate.I-laser ingasebenza endaweni engu -40~+65 degrees, kodwa amandla okukhiphayo azohluka emazingeni okushisa ahlukene.Ngokuvamile, amandla okukhipha i-laser makhulu kunama-70% yenani elivamile kuma-degree angu-65.
I-PIC 2-2 30W Ubukhulu Bokukhanya Okuhlaza
Phina | Phina incazelo | Phina | Phina incazelo |
1 | I-Thermistor | 6 | LD2- |
2 | I-Thermistor | 7 | I-LD3+ |
3 | I-LD1+ | 8 | LD3- |
4 | LD1- | 9 | I-LD4+ |
5 | I-LD2+ | 10 | LD4- |
Imiyalo yokusetshenziswa
Uma i-laser isebenza, gwema ukuchayeka nge-laser emehlweni nasesikhumbeni.Izinyathelo ezimelene ne-static kumele zithathwe ngesikhathi sokuthutha, ukugcinwa kanye nokusetshenziswa.Ukuvikelwa kwesekethe iDemo kuyadingeka phakathi kwezikhonkwane ngesikhathi sokuthutha nokugcinwa.Kuma-laser ane-current esebenzayo engaphezu kuka-6A, sicela usebenzise i-welding ukuze uxhume umkhondo.Ngaphambi kokusebenzisa i-laser, qiniseka ukuthi ukuphela kokuphuma kwefayibha kuhlanzwe kahle.Landela izimiso zokuphepha ukuze ugweme ukulimala lapho ubamba futhi usika imicu.Sebenzisa amandla amanje angashintshi ukuze ugweme ukushuba lapho usebenza.Kufanele isetshenziswe ngamandla amanje alinganiselwe futhi alinganiselwe.Lapho i-laser isebenza, kuyadingeka ukuze uqinisekise ukushabalaliswa kahle kokushisa.Izinga lokushisa elisebenzayo -40°C~ 65°C.izinga lokushisa lesitoreji-20°C~+80°C.
Ukucaciswa Komkhiqizo Okuvamile(25℃) |
Uphawu |
Iyunithi | Inombolo yesitayela:BDT-B525-W30 | |||
Okuncane. | inani elijwayelekile | Ubukhulu.Inani | ||||
Imingcele ye-Optical | Amandla Okukhiphayo | Po | W | 30 | - | Customizable 200W |
Ubude begagasi obumaphakathi | lc | nm | 520±10 | |||
Ububanzi be-Spectral (FWHM) | △l | nm | 6 | |||
I-Temperature Drift Coefficient | △l/△T | nm/℃ | - | 0.06 | - | |
I-coefficient yamanje ye-drift | △l/△A | nm/A | - | / | - | |
Imingcele kagesi | Ukusebenza kahle kwe-electro-optical | PE | % | - | 10 | - |
Ukusebenza kwamanje | Iop | A | - | 1.8 | 2 | |
I-Threshold current | Ith | A | - | 0.3 | - | |
I-Operating Voltage (1) | Vop | V | - | 37 | 44 | |
Ukusebenza kahle kwe-slope | η | W/A | - | 12.5 | - | |
Imingcele ye-Fiber | I-Fiber Core Diameter | I-Dcore | µm | - | 105 | - |
I-Cladding Diameter | Dclad | µm | - | 125 | - | |
I-Coating Diameter | Dbuf | µm | - | 245 | - | |
Ukuvuleka kwezinombolo | NA | - | - | 0.22 | - | |
Ubude befayibha | Lf | m | - | 2 | - | |
Ikhava yefiber Ububanzi/Ubude | - | mm | 0.9mm/2m | |||
Irediyasi egobayo | - | mm | 50 | - | - | |
Isixhumi | - | - | - | FC/PC或SMA905 | - | |
Abanye | ESD | I-Vsd | V | - | - | 500 |
izinga lokushisa lokugcina (2) | Tst | ℃ | -40 | - | 80 | |
Izinga lokushisa le-soldering | Tls | ℃ | - | - | 260 | |
Isikhathi sokushisela | t | isekhondi | - | - | 10 | |
Izinga lokushisa lokusebenza (3) | Phezulu | ℃ | -40 | - | 65 | |
Umswakama ohlobene | RH | % | 15 | - | 75
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UMDLALO 1Umdwebo Wohlaka Lwesistimu