525nm Green Laser-1W-B
Izingxenye ze-laser ye-semiconductor zingamandla aphezulu, zisebenza kahle kakhulu, kanye nemikhiqizo ezinzile eyenziwe ngobuchwepheshe bokuhlanganisa obuchwepheshile.Umkhiqizo ugxilisa ukukhanya okukhishwa yi-chip ku-fiber optical enobubanzi obuncane bomgogodla ngokusebenzisa izingxenye ze-micro-optical ukuze okukhiphayo.Kule nqubo, yonke inqubo ebalulekile iyahlolwa futhi iguge ukuze kuqinisekiswe ukwethembeka, ukuzinza nempilo ende yomkhiqizo.
Ekukhiqizeni, abacwaningi baqhubeka bethuthukisa inqubo yomkhiqizo ngobuchwepheshe bomsebenzi nolwazi oluqoqiwe lwesikhathi eside ukuze kuqinisekiswe ukusebenza okuphezulu komkhiqizo.Inkampani iphinde iqhubeke nokuthuthukisa imikhiqizo emisha ukuze ihlangabezane nezidingo ezikhula njalo zamakhasimende.Izintshisekelo zamakhasimende bezilokhu zibekwe kuqala, futhi ukuhlinzeka amakhasimende ngemikhiqizo yekhwalithi ephezulu, engabizi kuwumgomo ongaguquki wenkampani.
Qaphela:
【1】Sicela ugcine endaweni engafinyeleli .
【2】 Izinga lokushisa elisebenzayo le-laser lisho izinga lokushisa le-base plate.I-laser ingasebenza endaweni engu -40~+65 degrees, kodwa amandla okukhiphayo azohluka emazingeni okushisa ahlukene.Ngokuvamile, amandla okukhipha i-laser makhulu kunama-70% yenani elivamile kuma-degree angu-65.
I-PIC 2-21W Ubukhulu Bokukhanya Okuluhlaza
Imiyalo yokusetshenziswa
Uma i-laser isebenza, gwema ukuchayeka nge-laser emehlweni nasesikhumbeni.u Izinyathelo eziphikisana ne-static kufanele zithathwe ngesikhathi sokuthutha, ukugcinwa kanye nokusebenzisa.Kudingeka ukuvikelwa komjikelezo omfushane phakathi kwamaphini ngesikhathi sokuthutha nokugcinwa.u Kuma-lasers anomfutho osebenzayo ongaphezu kuka-6A, sicela usebenzise i-welding ukuxhuma umkhondo..u Ngaphambi kokusebenzisa i-laser, qiniseka ukuthi ukuphela kokuphuma kwefayibha kuhlanzwe kahle.Landela izimiso zokuphepha ukuze ugweme ukulimala lapho ubamba futhi usika imicu.u Sebenzisa ugesi oqhubekayo wamanje ukuze ugweme ukuhlinza lapho usebenza.u Kufanele isetshenziswe ngamandla amanje akalwe futhi akalwe.u Lapho i-laser isebenza, kuyadingeka ukuqinisekisa ukuchithwa okuhle kokushisa.Ukushisa okusebenzayo -40°C~ 65°C.Ukushisa kwesitoreji -20°C~+80°C.
| Ukucaciswa Komkhiqizo Okuvamile(25℃) |
Uphawu |
Iyunithi | Inombolo yesitayela:BDT-B525-W1 | |||
| Okuncane. | Inani elijwayelekile | Ubukhulu.Inani | ||||
|
Imingcele ye-Optical | Amandla Okukhiphayo | Po | W | 1 | - | Customizable 200W |
| Ubude begagasi obumaphakathi | lc | nm | 520±10 | |||
| Ububanzi be-Spectral(FWHM) | △l | nm | 2 | |||
| I-Temperature Drift Coefficient | △l/△T | nm/℃ | - | 0.06 | - | |
| I-coefficient yamanje ye-drift | △l/△A | nm/A | - | / | - | |
|
Imingcele kagesi | Ukusebenza kahle kwe-electro-optical | PE | % | - | 10 | - |
| Ukusebenza kwamanje | Iop | A | - | 1.8 | 2 | |
| I-Threshold current | Ith | A | 0.2 | 0.3 | 0.5 | |
| I-Voltage yokusebenza | Vop | V | - | 4.5 | 5.5 | |
| Ukusebenza kahle kwe-slope | η | W/A | - | 0.63 | - | |
|
Imingcele ye-Fiber | I-Fiber Core Diameter | I-Dcore | µm | 62.5 | 105 | - |
| I-Cladding Diameter | Dclad | µm | - | 125 | - | |
| I-Coating Diameter | Dbuf | µm | - | 245 | - | |
| Ukuvuleka kwezinombolo | NA | - | - | 0.22 | - | |
| Ubude befayibha | Lf | m | - | 2 | - | |
| I-Fiber Cover Diameter/Ubude | - | mm | 0.9mm/2m | |||
| Irediyasi egobayo | - | mm | 50 | - | - | |
| Isixhumi | - | - | - | FC/PC noma SMA905 | - | |
|
Abanye | ESD | I-Vsd | V | - | - | 500 |
| izinga lokushisa lesitoreji (1) | Tst | ℃ | -40 | - | 80 | |
| Izinga lokushisa le-soldering | Tls | ℃ | - | - | 260 | |
| Isikhathi sokushisela | t | isekhondi | - | - | 10 | |
| Izinga lokushisa lokusebenza (2) | Phezulu | ℃ | -40 | - | 65 | |
| Umswakama ohlobene | RH | % | 15 | - | 75
| |
UMDLALO 1Umdwebo Wohlaka Lwesistimu
